Tenders
1
Empanelment of Software Development Agencies
Tender Reference No.:
STPI/TECH/NSIG/MISC/24-25/2/II
STPI/TECH/NSIG/MISC/24-25/2/II
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
Bid Submission End Date :
Bid Opening Date:
Tender EMD (Earnest money deposit)
₹50,000/-
Software Technology Parks of India (STPI) invites Empanelment bid from reputed vendors for the Empanelment of Software Development Agencies (SDAs) as mentioned in the EoI document.
CPP Tender ID: 2026_DIT_920778_1
Link to Pre-Bid Meeting:
https://stpi.webex.com/meet/stpihqvc
Other Tender Documents:
- RFP Document
(476.33 KB) Tender Related Documents
(205.93 KB)